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TJM Electronics West is a family owned and operated company which introduced its Arizona facility in 1993 in support of a high tech semiconductor corporation and its development of ISA and MCI Bus Digital video cards. These high exposure digital video cards showcased the company's RISC and Pixel Processors. Services consisted of fast turn prototype assembly, modifications and diagnostics on both the IBM PC and PS2 platforms. By 1994 TJM Electronics West started providing electronics assembly services to many other high tech electronics companies in the Phoenix area. In June of 2000, TJM expanded into its third and current location in Tempe. |
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TJM Electronics Associates
is a highly technical state of
the art electronic contract manufacturer, diversified in its service support of
over 70 customers. We are a family owned and operated business whose primary
goal and focus has always been to insure the success of our customers. We have
grown to two facilities and over 80 people specializing in the field of robotic
surface-mount electronic assembly. While working in engineering support at the
David Sarnoff Research Center, we became involved in the development of this
process and the component standardization for building today’s printed circuit
boards. TJM was a founder of the Surface-Mount Technology Association promoting
the equipment and processes used to build the sub assemblies used in all
electronic instruments.
TJM Electronics Associates, by the nature of
the new processes it utilizes, has always attracted potential
customers. An approach was taken early on to project a match
between the customer requirements and our own capabilities. Since
the beginning we have focused on serving customers who needed
support in doing development prototypes and pilot runs on new
products & processes we could grow with. Our advanced technology
labs work in support of many of today’s largest semi-conductor
manufacturer profiling processes for new packages.
TJM Electronics Associates
worked with AT&T engineers over fifteen years ago is early
development of BGA packages. Today we’re involved with OnSemi and
Motorola in the process requirement for the new QFN packages. Some
assemblies we build for Defense Systems have
over 4000 components with 36 BGA’s mounted on both sides.
Besides advance reflow profiling and
solder stencil designs, TJM Electronics Associates is
equipped with Ionic contamination testers, and X-Ray inspection.
Our sixteen pick/place machines not only puts us in position for
fast turn short runs (2 to 3 days), but also gives us the depth to
support runs in the tens of thousands per month.
Contact us to
learn what
TJM Electronics Associates can do for you.
